Equipment

The institute is equipped with several pilot plants for large-area coating in batch, in-line or roll-to-roll processes as well as with electron beam equipment for the efficient modification of surfaces. Using these plants we can refine flat substrates made from glass, plastics or metal as well as flexible surfaces like metal strips or polymer films as well as 3-dimensional components.

Coating of flat substrates

ILA 900 Vertical in-line sputtering plant for coating large surfaces
ILA 750 Vertical in-line sputtering plant

Coating of flexible substrates

novoFlex®600 Roll-to-roll pilot web coater
coFlex® 600 Roll-to-roll pilot sputter roll coater
labFlex® 200 Lab sputter roll coater
LB 9 Laboratory coater
atmoFlex 1250 Roll-to-roll pilot wet coating line
FOSA LabX 330 Glass Web coating system for flexible substrates (in cooperation with VON ARDENNE GmbH)

Coating of sheets and metal strips

MAXI
In-line vacuum coating equipment for sheets and metal strips
EMO Laboratory coater with EB evaporator
VERSA Pilot plant for plasma-enhanced electron-beam vapor deposition
CLAIRE
In-line plant for wet chemical surface treatment priot to coating

Electron beam applications

REAMODE Experimental equipment for modifying organic materials using accelerated electrons
ERICA
Vacuum cluster tool for complex coating and structuring processes
EFFI
Electron beam machine for surface structuring and for fine and micro welding processes
CLAIRE In-line plant for wet chemical surface treatment prior to coating

Coating of components

ALMA 1000 Experimental plant for coating bulk goods via plasma-activated high-rate deposition
UNIVERSA Laboratory coater for layer deposition by means of pulse magnetron sputtering
NOVELLA Facility for coating 3D components

Precision coating

CLUSTER 300
Plant for stationary magnetron sputtering
PreSensLine  

Microdisplays and Sensors

300 m2 Clean Room Class 10
Etching / Sputtering Clustex 200 | Leybold Optics
Spin coating EVG120 | EVG
Nitrogen oven MB-OV | Mbraun
Etching, Thermal evaporation, Electron beam, Vitex/Barix™ thinfilm encapsulation, Helisys | ANS Korea
Fully-automated wafer bonding system Hercules | EVG
Photolithography (orthogonal, nanoimprint). EVG IQ + Brewer automatic processing station
Wafer prober Pegasus PA200 | Wentworth
Ellipsometer M-2000U | J. A. Woollam

Clean Room

Fraunhofer FEP uses a modern class 10 clean room of more than 900 m² (refitted in 2008) to meet the demands of further system engineering. Fraunhofer FEP has at its disposal infrastructure unique throughout Europe concerning research, development and pilot fabrication of organic devices.

Fraunhofer FEP process lines:

Prototype line: Rigid/flexible substrates

Substrate size 200 x 200 mm²
Substrate type glass or foil

Pilot line: Rigid substrates

Substrate size 370 x 470 mm² (Generation 2)
Substrate type glass

Pilot line: OLED-on-CMOS

Substrate size 150 or 200 mm diameter
Substrate type Silicon / CMOS wafer
Cycle time 60 minutes
Pilot max. volume substrates / year 6000
Pilot max. volume area -
Prototype / technology research & development Ready

Roll-to-Roll

Substrate size up to 300 mm width
Substrate type metal foil and plastic web

Parts of the equipment have been funded by the European Union and the Free State of Saxony.