IC and system design

Our long-term experience in design of analog, mixed-signal, digital IC provides a basis for the realization of customized solutions. The typical applications follow the slogan more-than-moore, in the integration of additional functions. Therefore the standard CMOS processes is disrupted namely the post-treatment is implemented (deposition of organic emitting or photo diodes). Fraunhofer FEP is fabless and works with various CMOS-foundries. For the post-treatment Fraunhofer FEP can use 200 mm cleanroom.

Our offer

Design of analog, digital and mixed-signal IC based on the state of the art. Typical CMOS-processes: : 0.13 μm / 0.18 μm / 0.35 μm

Design steps:

  • Concept
  • Modelling
  • System design
  • Circuit design
  • Simulation
  • Layout
  • Verification
  • Coordination of external CMOS-wafer fabrication as a contractor between the customer and the foundry
  • Test
  • Commissioning
  • Life-time tests


  • Unidirectional OLED microdisplays (OLED-on-silicon)
  • Bidirectional microdisplays with embedded image sensors
  • Hall sensor
  • Display controller for passive OLED
  • Displays
  • Radiation detector
  • Sensor signal processing


  • Post-processing of Si-wafers
  • OLED/OPD deposition
  • Encapsulation
  • Development of optical filters
  • Structuring with shadow masks or photolithography
  • Wafer integration