Press releases 2018

The Glass@Service joint project was launched in March 2016, funded by the German Federal Ministry for Economic Affairs and Energy (BMWi) as part of the “Smart Service Welt – Internetbasierte Dienste für die Wirtschaft” (Smart Service World – Internet-based Services for Business) technology competition. The goal of the project is to establish interactive personalized visualization within industrial processes by means of data glasses and other wearables using the "digital factory" in electronics fabrication as an example. A prototype of the data glasses that have been developed will now be debuted at the Fraunhofer FEP booth in the Organic and Printed Electronics Working Group (OE-A) Joint Booth No. 43164 during the Consumer Electronics Show (CES 2019) in Las Vegas, USA, from January 8 – 12, 2019

Working within the framework of Lyteus, Holst Centre and Fraunhofer FEP step into the spotlight with the creation of the world’s longest single-device OLED. At a stunning 15 meters in length it opens the door to ‘endless OLEDs’ that manufacturers and designers can then easily tailor to their own needs.

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP has acquired extensive know-how in the field of electron-beam technology over many years. As a result, processes and equipment have been designed and implemented for a wide variety of applications, such as for seed dressing, and for cross-linking and curing of paints. Now a new design for the treatment of liquids is being presented: the ELLI 300 system (ELectron treatment of LIquids).

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP has been successfully developing OLED microdisplays based on OLED-on-silicon technology for years. Several generations of different designs have already been created. At the same time, the necessary electronics and system environment for future augmented reality (AR) applications are being developed at full speed. The developers will be debuting an innovative and powerful set of tools for independent development of wearables using OLED microdisplays at the Fraunhofer Joint Booth (no. 426, Hall C5) during electronica 2018, November 13-16, 2018 in Munich, Germany.

After the announcement of the positive decision for the cluster of Exellence CeTI (Center for Tactile Internet with Human-in-the-Loop) of the Technische Universität Dresden (TUD), the scientists of the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP in Dresden are also pleased about new opportunities for research and development of solutions for efficient cooperation between human and human as well as humans and machine. With more than 10 years of experience in manufacturing of OLED microdisplays, the research institute will contribute to the development of mobile displays with multimodal feedback.

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP has been involved in developing processes and equipment for cleaning, sterilization, and surface modification for decades. The CleanHand Network for development of systems and technologies to clean surfaces, materials, and objects was established in May 2018 to bundle the expertise of many partnering organizations. As a partner in the CleanHand Network, Fraunhofer FEP will present the Network and current research topics of the Institute in the field of hygiene and cleaning at the parts2clean trade fair, October 23-25, 2018 in Stuttgart, at the booth of the Fraunhofer Cleaning Technology Alliance (Hall 5, Booth C31).

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP is a provider of research and development services for OLED-on-silicon-technology. At the awe europe 2018, in Munich/Germany, the institute will present large-area high-resolution low-power OLED microdisplays suitable for the next generation of compact VR glasses. A Prototype of VR glasses and the new displays can be seen from October 18th to 19th, 2018 at booth no. 322.

Scientists at the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP have investigated new approaches for depositing low-defect insulating layers, part of the joint project “NaFuSS“ (German Federal Ministry of Education and Research/BMBF promotional reference number 13N13171). The aim is to increase the reliability and durability of pressure sensors for hydrogen technology, an area that is becoming increasingly important. The new approaches and results of the study will be presented at both the 16th International Conference on Plasma Surface Engineering PSE in Garmisch-Partenkirchen, Germany, September 17-21, 2018 and at electronica 2018 (Booth 426 in Hall C5) in Munich, Germany, November 13-16, 2018.

Safety helmets with built-in microdisplays and multifunction data glasses will soon monitor production lines, advise workers of dangers, and display storage locations. The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP is developing OLED microdisplays and sensors as the foundation for intelligent data glasses in the sectors of medicine, vehicle production, entertainment, and for Industry 4.0. The respective display design and parameters such as resolution, pixel size, and supplementary functions can be varied and combined depending on the application, such as for monitoring manufacturing processes or in logistics. The range of displays runs from high-resolution microdisplays in extended full HD for AR/VR applications to variants with ultra-low power consumption for consumer wearables. Evaluation kits are available from Fraunhofer FEP as development tools.

Organic light-emitting diodes (OLED) are mainly known from televisions and smartphone displays. They can be used as lighting objects in car tail lights or lights. The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP as a partner for customer-specific OLED development and production is now presenting OLED elements that can be integrated into textiles at the Electronics System Integration Technology Conference ESTC 2018 from September 18 - 21, 2018 in Dresden at booth no. 29.