Equipment

The institute is equipped with several pilot plants for large-area coating (batch, in-line or roll-to-roll processes), electron beam equipment for the efficient modification of surfaces and several clean rooms for the development and pilot production of organic electronics, sensors and microdisplays. Using these plants we can refine flat substrates made from glass, plastics or metal as well as flexible surfaces like metal strips, polymer films or flexible ultra-thin glass as well as 3-dimensional components. The equipment technology in the clean rooms enables coating on 200 mm wafers as well as on glass or film substrates up to 200 x 200 mm² with e. g. organic electronics.

Coating of flat substrates

ILA 900	Vertical in-line sputtering plant for coating large surfaces
ILA 750	Vertical in-line sputtering plant

Coating of flexible substrates

novoFlex^®600	Roll-to-roll pilot web coater
coFlex^® 600	Roll-to-roll pilot sputter roll coater
labFlex^® 200	Lab sputter roll coater
vapoFlex	Laboratory coater
atmoFlex 1250	Roll-to-roll pilot wet coating line
FOSA LabX 330 Glass	Web coating system for flexible substrates (in cooperation with VON ARDENNE GmbH)

Coating of sheets and metal strips

MAXI	In-line vacuum coating equipment for sheets and metal strips
EMO	Laboratory coater with EB evaporator
VERSA	Pilot plant for plasma-enhanced electron-beam vapor deposition
CLAIRE	In-line plant for wet chemical surface treatment priot to coating

Electron beam applications

REAMODE	Experimental equipment for modifying organic materials using accelerated electrons
ERICA	Vacuum cluster tool for complex coating and structuring processes
EFFI	Electron beam machine for surface structuring and for fine and micro welding processes
CLAIRE	In-line plant for wet chemical surface treatment prior to coating
TABEA	Mobile test rig for electron beam-based environmental technologies

Coating of components

ALMA 1000	Experimental plant for coating bulk goods via plasma-activated high-rate deposition
UNIVERSA	Laboratory coater for layer deposition by means of pulse magnetron sputtering
NOVELLA	Facility for coating 3D components

Precision coating

CLUSTER 300	Plant for stationary magnetron sputtering
PreSensLine	In-line sputtering system for precision coating of large substrates
LB nano	Vacuum coating equipment

Microdisplays and Sensors

300 m² Clean Room Class 10

Etching / Sputtering Clustex 200 | Leybold Optics

Spin coating EVG120 | EVG

Nitrogen oven MB-OV | Mbraun

Etching, Thermal evaporation, Electron beam, Vitex/Barix™ thinfilm encapsulation, Helisys | ANS Korea

Fully-automated wafer bonding system Hercules | EVG

Photolithography (orthogonal, nanoimprint). EVG IQ + Brewer automatic processing station

Wafer prober Pegasus PA200 provided by EVERBEING INT´L Corporation | Wentworth

Ellipsometer M-2000U | J. A. Woollam

Clean Room

Fraunhofer FEP uses a modern class 10 clean room of more than 900 m² (refitted in 2008) to meet the demands of further system engineering. Fraunhofer FEP has at its disposal infrastructure unique throughout Europe concerning research, development and pilot fabrication of organic devices.

Fraunhofer FEP process lines:

Prototype line: Rigid/flexible substrates

Substrate size	200 x 200 mm²
Substrate type	glass or foil

Pilot line: Rigid substrates

Substrate size	370 x 470 mm² (Generation 2)
Substrate type	glass

Pilot line: OLED-on-CMOS

Substrate size	150 or 200 mm diameter
Substrate type	Silicon / CMOS wafer
Cycle time	60 minutes
Pilot max. volume substrates / year	6000
Pilot max. volume area	-
Prototype / technology research & development	Ready

Roll-to-Roll

Substrate size	up to 300 mm width
Substrate type	metal foil and plastic web

Parts of the equipment have been funded by the European Union and the Free State of Saxony.