
The PreSensLine is a coating system for dynamic coating by reactive pulse magnetron sputtering based on an in-line deposition principle. The equipment allows fabrication of high-precision complex multilayer coating systems, gradient coating systems and freeform coatings on large flat and curved substrates.
Prior to coating, the substrates are applied to the substrate carrier under ISO class-5 cleanroom conditions. Plasma etching for cleaning and magnetrons for the application of adhesion layers are available in the load lock chamber as pre-treatments.
Coating takes place in a process chamber comprising of two coating stations, each equipped with up to three sputter sources. A substrate heater as well as optical and pyrometric in situ measuring equipment is located between the stations.
Our expertise covers process optimization of reactive pulse magnetron sputtering for highly complex customer requirements. This includes to adjust a variety of layer properties to meet the demands from new applications in optics and sensor technology. This is possible by additional degrees of freedom (i. e. process parameters) based on innovative key components and technologies.
The coating system and sputtering sources employed are designed for precision coatings with low particle generation and characterized by high productivity.
The variety of available materials opens up almost unlimited opportunities for applications such as optical interference layer systems, electrical and piezoelectric layers, active sensor layers as well as protective and barrier layers.
Coating process | Reactive pulse magnetron sputtering (two coating stations each with two RM 800 magnetrons) |
Substrate handling | Substrate handling within an ISO class-5 cleanroom |
Substrate pre-treatment | Plasma etching (RP 800 Plasmatreater), adhesion layers |
Combined substrate movement | Very precise substrate translation and rotation by linear and rotation motors, excellent accuracy +/- 0.025 % High dynamics: linear up to 0.5 m/s and 3 m/s², rotation up to 7200 °/s (1200 rpm) and 360 °/s² |
Substrate dimensions | 650 mm × 750 mm × 120 mm, up to Ø 550 mm for rotating substrates |
Optimized design for minimal particle generation |
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Base / process pressure | 1·10-6 mbar / 1·10-3 ... 1·10-2 mbar |
Inert / reactive gases | Ar / O2, N2 |
Vacuum pump-down system | Oil-free pre- and high-vacuum pumps |
Process options | Substrate heating (up to 400°C), substrate bias (DC or pulse) |
In situ measurement technology | Ellipsometer, pyrometer |