Sputtering technologies

Sputtering technologies are one of the core technologies of Fraunhofer FEP. They enable the efficient deposition of layers and multilayer systems in a vacuum on large surfaces. Sputtering processes are particularly suitable for the precise deposition of thin, electrical and optical functional layers on an industrial scale. These processes guarantee layer thickness precision, low roughness and high layer adhesion.

Our institute specializes in pulse magnetron sputtering (PMS) and the control of reactive sputtering processes. Interfering arcing processes can be minimized through the pulsed injection of electrical energy during the magnetron gas discharge. The reactive process control extends the range of materials that can be deposited, so that oxides, nitrides and oxynitrides can also be applied in addition to metals.

The dual magnetron sputtering system (DMS) can be used to deposit highly electrically insulating materials.

The Fraunhofer FEP utilizes and develops sputtering methods to provide innovative solutions for complex coating requirements. This includes the application of functional layers in sheet-to-sheet and roll-to-roll processes as well as on 3D components.

• Specialization in pulse magnetron sputtering (PMS) and reactive sputtering processes
• Application opportunities for metals, oxides, nitrides and highly insulating materials
• Innovative solutions for various coating requirements and technologies

Fraunhofer FEP offers comprehensive expertise in process and technology development for coating technologies and layer systems according to your application along the entire value chain:

• Feasibility studies
• Development of the coating technology and coating system for your product
• Sample coatings
• Development of key assemblies
• Technology transfer to production
• Support with system realization for our customers
• Licensing

This development work is supplemented and supported by

• Acquisition and coordination of projects subsidized by the state, the federal government and the European Union
• Economic feasibility studies
• Studies on the state of the art, e.g. literature and patent research

Reactive pulse magnetron sputtering and magnetron PECVD

With reactive pulse magnetron sputtering (PMS), compound layers of very high quality can be deposited at a high coating rate. This involves sputtering from electrically conductive targets and simultaneously injecting reactive gas or a reactive gas mixture.

The layer is formed from the sputtered target material and its reaction with the reactive gas on the substrate surface. The coating rate is usually an order of magnitude higher than with high-frequency sputtering of the compound target.

In the magnetron PECVD process, a precursor is introduced. The plasma leads to a chemical reaction and the deposition of inorganic, organic or hybrid layers on the substrate. No or only a very small amount is dusted from the target and incorporated into the layer. The coating rate is up to an order of magnitude higher than with reactive PMS.

Dynamic / stationary coating

New degrees of freedom for demanding layer property portfolios

In dynamic sputtering, the substrate moves in front of the sputter spurce. This process is usually used in so-called in-line systems for large substrates or a large number of smaller substrates that are attached to carriers. With stationary sputtering, the substrate remains in front of the sputtering station. 

It is generally used for single substrate coating (currently up to 300 mm, in future up to 450 mm diameter) or for several small substrates on a carrier in so-called cluster systems.

Pulsed magnetron sputtering can be operated reactively from metallic targets or non-reactively from electrically conductive ceramic targets. Thus enables a wide range of materials to be deposited.

In addition to classic optimization parameters such as process pressure, substrate temperature and substrate bias, Fraunhofer FEP has opened up new degrees of freedom and developed the necessary key components and technologies. By setting the pulse mode (uni polar, bipolar, pulse package) and pulse parameters (duty cycle) of the pulsed energy input into the plasma, the energy input into the growing layers can be controlled and previously inaccessible layer properties or combinations of properties can be set - with a high coating rate at the same time.

Integrated process-related measurement and control technology for the reactive gas supply and tracking of the magnetic field over the course of the target service life also ensure high reproducibility of the plasma conditions and thus the layer properties in continuous operation.

We develop harmonized, system-defining key components for reactive pulse magnetron sputtering. Together with the processes and technologies adapted to the coating task, these can be used as integrated packages to expand the possibilities of new or existing coating systems.

• Multi-ring magnetron (MRM) sources for stationary coating
  • Uniform coating thicknesses and coating properties currently up to 200 mm, in future up to 450 mm diameter
  • Separately controllable concentric plasma discharges (two or three rings) for homogeneous coating. three rings) for homogeneous deposition or for adaptation to curved surfaces
• Rectangular magnetron (up to 2 m long) for dynamic coating 
• Pulse power supplies
• Process control units