Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
In-line sputtering system for precision coating of large substrates using the following technologies:
- pulsed sputtering
- plasma pre-treatment
Typical substrates
- Substrate size: 650 mm × 750 mm × 120 mm
- rotating substrates: up to Ø 550 mm
- substrate rotation: up to 20 Hz
Range of applications
- Development and optimization of coating technologies and coating systems
- Coating of samples and pilot productions
- Development of key assemblies, such as magnetron sputter sources and plasma etchers