Backplane

Information about the project

In collaboration with GLOBALFOUNDRIES Dresden, Module One LLC & Co. KG and digades GmbH, Fraunhofer FEP is currently researching a solution for energy-saving and high-resolution OLED microdisplays and quality cameras. From now on they could be used in driving assistance systems up to autonomous driving, gesture control, lifestyle products as well as for civil security purposes.

The aim is to implement an ultra-low-power microdisplay backplane architecture in a deep-submicron CMOS process for the first time in order to significantly reduce the space requirements of the memory elements for static RAM (SRAM), which have been predominant up to now. This will enable a higher pixel density and thus color image reproduction in the first place while maintaining extremely low power consumption. This technology is to be used in a head-up display for motorcyclists.

Funded by:
Sächsisches Staatsministerium für Wirtschaft, Arbeit und Verkehr
Funding reference: 100392259       
Duration:
30.12.2019 - 31.12.2021     

 

 

Project partners

  • GLOBALFOUNDRIES Dresden Module One LLC & Co. KG
  • digades GmbH
  • Fraunhofer-Institut für Organische Elektronik, Eleoktronenstrahl- und Plasmatechnik FEP