Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP
Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP

pro flex 2013 Program

TUESDAY, SEPTEMBER 24th
Session 1
 Chair: Dr. N. Schiller

09:30 – 09:40

Opening
N. Schiller
Fraunhofer FEP [Germany]

09:40 – 10:20

Invited Paper
New technologies for vacuum roll-to-roll coating PECVD for high barrier coatings – Sputter deposition on flexible glass
H. Tamagaki, T. Okimoto, Y. Kurokawa, T. Segawa,
Y. Ikari, N. Ohba
Kobe Steel Ltd. [Japan]

10:20 – 10:40

Ultra-thin flexible glass substrates for electronics applications
J.-M. Jouanno
Corning Inc. [USA]
10:40 – 11:10 Coffee Break
Session 2
Chair: Dr. M. Fahland
11:10 – 11:30 A study of adhesive improvement of a Cr-Ni alloy layer on a polyimide surface by low pressure gas plasma modification
K. Miyauchi, H. Yamabe, M. Yuasa
Sumitomo Metal Mining Co., Ltd. [Japan]
11:30 – 11:50 Successful substrate cleaning in a high vacuum environment
S. Hamilton
Teknek, Ltd. [UK]
11:50 – 12:10 Managing flexible webs for vacuum roll-to-roll deposition for electronic or ultra-barrier applications
C. A. Bishop
C. A. Bishop Consulting, Ltd. [UK]
12:10 – 15:30 Industry Lunch
Networking event and exhibition
Take the opportunity to meet our exhibitors:
  • Adenso GmbH
  • amtec Analysenmesstechnik GmbH
  • DTF Technology GmbH
  • MKS Instruments Deutschland GmbH
  • robeko
  • SEMPA SYSTEMS GmbH
  • VON ARDENNE Anlagentechnik GmbH
15:30 – 15:50 Flexible solar cells
U. Bewersdorff-Sarlette
Heliatek GmbH [Germany]
15:50 – 16:10 Printing versus coating technologies – In which direction the future production technologies for printed electronic is going?
A. Glawe, F. Schäfer
KROENERT GmbH & Co. KG [Germany]
16:10 – 16:30 Freeform and flexible electronics manufacturing using roll-to-roll printing and hybrid integration techniques
J. Hast, K. Rönkä
VTT Technical Research Centre of Finland [Finland]
16:30 – 16:50 Roll-to-roll processing of flexible OLEDs
C. Lehmann, S. Mogck, T. Wanski, C. May
Fraunhofer COMEDD [Germany]
16:50 – 17:10 Direct laser interference patterning, a new tool for large area surface functionalization of flexible materials
A.-F. Lasagni, S. Eckhardt, J. Berger, D. Benke
Fraunhofer IWS [Germany]
17:10 – 17:30 Activities of Saint Gobain in window film
C. Leyder
Saint Gobain Performance Plastic [France]

20:00
Dinner Restaurant
»Sophienkeller im Taschenbergpalais«

WEDNESDAY, SEPTEMBER 25th
Session 4
Chair: Dr. J. Fahlteich
09:30 – 09:50 Roll-to-roll processes and equipment for displays:
State of the art and outlook
R. Kukla, N. Morrison, T. Deppisch
Applied Materials GmbH & Co. KG [Germany]
09:50 – 10:10 Piloting roll-to-roll ALD – Status and results with 500 mm wide web system
M. Söderlund, P. Soininen
Beneq Oy [Finland]
10:10 – 10:30 Spatial atmospheric atomic layer deposition for next-generation flexible devices
F. Roozeboom, P. Poodt, A. Illiberi
Holst Centre TNO [The Netherlands]
10:30 – 11:00 Coffee Break
Session 5
Chair: Dr. S. Günther
11:00 – 11:20 ALD and MLD passivation layers for flexible OLED and OPV
C. Hossbach, H. Klumbies, F. Nehm, C. Richter, A. Singh,
C. Keibler, M. Geidel, L. Müller-Meskamp, U. Schröder,
M. Albert, J. W. Bartha
Technische Universität Dresden,
Institute for Semiconductor and Microsystems Technology (IHM) [Germany]
11:20 – 11:40 PPD – An innovative technology for deposition on flexible substrates
C. Taliani, A. Neri, D. Yarmolich
Organic Spintronics Srl. [Italy]
11:40 – 12:00 Flash lamp annealing: High temperature processing of layers on flexible substrates
T. Gebel, H. Liepack, M. Neubert, W. Skorupa, R. Endler
DTF Technology GmbH [Germany]
12:00 – 13:00 Lunch
Session 6
Chair: Dr. M. Fahland
13:00 – 13:20 Rotatable magnetron sputtering in roll-to-roll web coating of optical layer stacks
H. Pröhl, M. Dimer, M. Hentschel, F. Otto, J. Strümpfel
VON ARDENNE Anlagentechnik GmbH [Germany]
13:20 – 13:40 The gas barrier and adhesion properties of organic thin layer deposited by physical vapor deposition
T. Ebata
TOYOBO Co. Ltd. [Japan]
13:40 – 14:00 The effects of intrinsic and extrinsic defects on moisture-barrier coatings on polymer substrates
A. Smith, D. Bird, D. Robbins, S. Edge, A. Cook
The Centre for Process Innovation Ltd., CPI [UK]
14:00 – 14:20 High performance gas barrier encapsulating materials for flexible organic devices
Y. Hagihara
LINTEC Corporation R&D Div. Research Center [Japan]
14:20 – 14:40 RF plasma polymer coating on polymeric substrates:
Study of barrier properties
S. Ligot, C. Nouvellon, F. Ajouaoui, F. Renaux, R. Snyders
Université de Mons [Belgium]
14:40 – 15:00 Photochemical approach to thin barrier films for the encapsulation of flexible laminar electronic devices
L. Prager, U. Helmstedt, H. Herrnberger, M. Münch, O. Kahle, F. Kita, A. Pender, M. Stasiak
Leibniz-Institut für Oberflächenmodifizierung IOM [Germany]
15:00 – 15:20 Ultra-low water vapor permeation measurement using Tunable Laser Absorption Spectroscopy (TDLAS)
W. Grählert, H. Beese, J. Grübler, J. Koch, K. Pietsch
Fraunhofer IWS [Germany]
Closing
15:20 – 15:30 Farewell and closing remarks
N. Schiller
Fraunhofer FEP [Germany]
15:30 – 17:30 Laboratory Tour
Fraunhofer FEP [Germany]
ca. 17:30 The End